3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Hardcover)
內容描述
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
Provides chapter-wise review questions and powerpoint slides as teaching tools
